Welcome to Bonders Ltd.

We are Microelectronic & Photonics Bonding Specialists based in the UK. Our team of engineers have decades of experience supporting and working alongside established businesses and newcomers to the sector. As an independent company we are able to work with any OEM to bring your equipment, products and services to UK companies. We have a long history of working with international equipment designers, manufacturers and suppliers. Get in touch to find out how we can work with your company to reach clients, new and existing, across the UK and Europe.

We're here to grow your business

Drop us a line to see how we can help you to grow your business, increase equipment sales and bring additional engineering and technical support to your portfolio. Our contract support rates are extremely competitive with rapid response support and field service engineering as standard. Our engineers have years of experience travelling globally for training, equipment buy-off and installations. Let us help to support your customers and support your business.

In-House Tooling Design

We also offer an in-house tooling design service which currently supports an increasing customer base of die bonding, wire bonding, wafer/die handling and vacuum reflow applications. We use the very latest 3D CAD design software, currently PTC Creo v9 to create custom tooling solutions for customers across a wide range of applications. We can work directly with an OEM to design solutions and with our network of specialist fabricators, both UK based and international, create your tooling.

Examples of our work

Our sister company specialises in contract application support, process development, prototyping and used microelectronic manufacturing equipment sales. They have their own facility complete with an extensive range of microelectronics assembly and inspection equipment. If this is of interest to you again please get in touch and we'll put you in contact!

Wire Bonding

We have extensive experience with ball and wedge wire bonding, including manual, semi-auto and fully automated wire bonding equipment.

Die Bonding

Our engineers have built up a great deal of knowledge of Eutectic, Epoxy & Pressure-less Sinter Die Bonding, along with Flip Chip, COB and PCB Assembly

Vacuum Reflow

We have been involved with vacuum reflow systems and in particular tooling design and process development for a number of clients.

Custom Tooling Design

Tooling design solutions for die bond, wire bond and vacuum reflow systems makes or breaks a process. Your bonding equipment is only as good as the tooling!

OEM Reps & Customer Buy Off

We are always on the look out for opportunities to represent equipment suppliers within the wire bond, die bond and vacuum reflow sectors, also associated tooling or consumables. We have experience working alongside a number of OEM and materials / consumables suppliers, from initial enquiries to project management right through assisting the procurement, installation and customer training.

Field Service Engineering

OEM representation is only part of what we do! - Our team of highly skilled and experienced UK based engineers will train on your equipment not only to support the installations and preventative maintenance procedures but also provide a rapid UK based response to resolve issues and support your customers.

We will fully champion your brand throughout.